Avago Technologies Ltd (NASDAQ:AVGO) should benefit from the robust LTE market in China in the first half of 2014. The company is seeing order strength from low-end, mid, and high-end segments primarily from bands 38-41.
Avago makes a broad range of analog semiconductor devices. Avago's product portfolio targets three markets including wireless communications, wired infrastructure and industrial & other. The company's key customers include Apple (NASDAQ:AAPL) and Samsung, and they are expected to account for 60-65 percent of sales in fiscal 2014.
The surging penetration of 4G-LTE in China 4G is a broad tailwind combined with content growth on marquee phones. The market is moving from a 2 band combination to a 3 band combination, which should be a tailwind in 2014.
10 Best Industrial Conglomerate Stocks To Watch Right Now: GigOptix Inc (GIG)
GigOptix, Inc. (GigOptix), incorporated on March 2008, is a supplier of semiconductor and electro-optical component products that enables high-speed end to end data streaming over optical fiber and wireless telecommunications and data-communications networks globally. The Company's products convert signals between electrical and optical formats for transmitting and receiving data over fiber optic networks and between electrical and high speed radio frequencies to enable the transmission and receipt of data over wireless networks. The Company is creating both optical telecommunications and data-communications applications for fast growing markets in 10 giga bytes per second (Gbps), 40Gbps and 100Gbps drivers, receiver integrated circuits (IC), electro-optic modulator components and multi-chip-modules (MCM), as well as E-band wireless data-communications applications for high speed mobile backhaul and other high capacity wireless data transport applications. During the year ended December 31, 2011, the Company shipped over 150 products to over 200 customers.
The Company offers a portfolio of 10Gbps and 40Gbps electro-optical products and is developing market for 100Gbps products. The Company provides bundled solutions that consist of a few of its products, such as modulator and driver. The Company also offers a comprehensive portfolio of Monolithic Microwave Integrated Circuit (MMIC) and application-specific integrated circuit (ASIC) products to support E-band wireless communication and defense markets. The Company has also developed 10Gbps vertical cavity surface-emitting laser (VCSEL) drivers and receivers for aerospace as well as outdoor, non-temperature controlled environments that enables higher capacity in its customers' next generation flight and data center systems.
The Company has a portfolio of products for telecommunications , data-communications, defenses and industrial applications designed for optical speeds from 3Gbps to over 100Gbps and for wireless frequencies! from zero giga hertz (GHz) to 86GHz. The Company's products support a range of data rates, protocols, transmission distances and industry standards.
The Company's portfolio consists of the product ranges, such as laser and modulator drivers for 10Gbps, 40Gbps and 100Gbps applications; receiver amplifiers or Trans-impedance Amplifiers (TIAs) for 10Gbps, 40Gbps and 100Gbps applications; VCSEL driver and receiver chipsets for 14 and 12 channel parallel optics applications from 3Gbps to 10Gbps; Electro-optic modulators based on the Company's TFPS technology suitable for various 40Gbps and 100Gbps modulation schemes, such as differential phase shift keying (DPSK), differential quadrature phase shift keying (DQPSK), RZ-DQPSK and DP-QPSK; wideband monolithic microwave integrated circuit (MMIC) amplifiers with flat gain response; high frequency MMIC Power Amplifiers with high gain and output power; high frequency passive attenuators and filters in small form factors, and standard cell, and structured ASIC and hybrid ASIC designs and manufacturing service for multiple markets offering information technology acquisition review (ITAR) compliance for defense applications. The Company designs and market products that amplifies electrical signals during both the transmission (amplifiers and optical drivers) and reception (TIAs) of optical signals as well as modulate optical signals in the transmission of data.
The Company's optical drivers amplify the input digital data stream that is used to modulate laser light either by direct modulation of the laser or by use of an external modulator that acts as a precise shutter to switch on and off light to create the optical data stream. The Company supplies an optimized component for each type of laser, modulator and photo-diode depending upon the speed, reach and required cost. The Company's microwave and millimeter wave amplifiers amplify small signal radio signals into more signals that can be transmitted over long distances to establish high t! hroughput! data connections or enable radar based applications. The Company's ASIC solutions are used in a number of applications such as defense and test and measurement applications to enable the high speed processing of complex signals.
The Company's product portfolio is designed to cover the range of solutions needed in these different modules. The Company's product portfolio consists of five product lines: GX Series, which includes serial drivers and TIA ICs devices for telecom and data-com markets; HX Series, which includes multi-channel driver and TIA ICs for short reach data-com and optical interconnect applications; LX Series, which includes TFPS modulators for high speed telecom and defense applications; EX Series, which includes amplifiers, filters and attenuators for microwave applications in defense and instrumentation, and CX Series, which includes family of ASIC solutions for custom integrated circuit design.
GX Series
The GigOptix GX Series of products services both the telecom and data-com markets with a broad portfolio of drivers and transimpedence amplifiers that address 10Gbps, 40Gbps and 100Gbps speeds over distances that range from 100 meters to 10,000 kilometers. The GX Series devices are used in FiberChannel, Ethernet, synchronous optical networking (SONET)/ synchronous digital hierarchy (SDH) components and those based upon the optical internetworking forum (OIF) standards.
HX Series
The GigOptix HX Series of products service the high performance computing (HPC), data-com and consumer markets with a portfolio of parallel VCSEL drivers and TIAs that address 3Gbps, 5Gbps,10Gbps, 14Gbps, 16Gbps and 25Gbps channel speeds over 100-300 meters distances in four and 12 channel configurations. The HX Series devices are used in HPC formats, Infiniband, Ethernet and optical high definition multimedia interface (HDMI) components.
LX Series
The GigOptix LX Series of products service the 40Gbps and above telecom! market f! or Mach-Zehnder modulators. The LX Series devices are based on the Company's TFPS EO material technology.
EX Series
The GigOptix EX Series of products leverages the high performance products acquired in the Endwave acquisition. In addition, it also includes the die and design techniques developed for the GX Series telecom and data-com drivers for related defense and instrumentation applications.
CX Series
The GigOptix CX Series of products offers a portfolio of distinct paths to digital and analog mixed signal ASICs with the capability of supporting designs of up to 10M gates in technologies ranging from 0.6 through 65nm. The CX Series uses the Company's technology in Structured and Hybrid ASICs to enable a generic ASIC solution that can be customized for a customer using only a few metal mask layers. The CX Series also offers ASIC services, including Analog and Mixed Signal IP into designs and taking customers designs from RTL or gate-level net list definitions to volume production with third party foundries.
The Company competes with TriQuint, Rohm, InPhi, Centellax, Semtech, Vitesse, M/A-Com, Avago, Emcore, Tyco Electronics, IPtronics. Avago, Emcore, Tyco Electronics, JDSU, Oclaro, Sumitomo, Fujitsu, Emcore, Oclaro, Hittite, Sumitomo, Hittite, RFMD, Northrop Grumman, On -Semiconductor, eSilicon, Open Silicon, Faraday, Toshiba and eASIC.
Advisors' Opinion:- [By maarnio]
Lightwave Logic�� main competitor is GigOptix (GIG). GigOptix has designed and patented potentially commercially feasible electro-optic polymers and holds an exclusive license to all electro-optic polymeric technology developed at the University of Washington.
- [By Bryan Murphy]
It's admittedly overbought and due for a slight dip thanks to today's surge. But when you take a step back and look at GigOptix Inc. (NYSEMKT:GIG), there's actually a lot to be excited about if you've been mulling a trading in GIG. The trick will be getting the timing right.
10 Best Semiconductor Stocks To Invest In Right Now: Aixtron SE (AIXG)
AIXTRON SE (AIXTRON), formerly AIXTRON AG, incorporated in 1983, is a provider of deposition equipment equipment to the semiconductor and compound-semiconductor industry. The Company's technology solutions are used by a diverse range of customers worldwide to build advanced components for electronic and opto-electronic applications based on compound, silicon, or organic semiconductor materials. Such components are used in fiber optic communication systems, wireless and mobile telephony applications, optical and electronic storage devices, computing, signaling and lighting, displays, as well as a range of other technologies. AIXTRON's business activities include developing, producing and installing equipment for coating semiconductor materials, process engineering, consulting and training, including ongoing customer support. AIXTRON supplies to customers both full production-scale complex material deposition systems and small scale systems for research and development (R&D) use and small-scale production use.
AIXTRON's product range includes customized production and research scale compound semiconductor systems capable of depositing material films on up to 95 * two-inch diameter wafers per single production run, or smaller multiples of larger diameter wafers, employing MOCVD or Hydride Vapor Phase Epitaxy (HVPE) or organic thin film deposition on up to Gen. 3.5 substrates, including Polymer Vapor Phase Deposition (PVPD) or Organic Vapor Phase Deposition (OVPD) or large area deposition for Organic Light Emitting Diodes (OLED) applications or Plasma Enhanced Chemical Vapor Phase Deposition (PECVD) for depositing complex Carbon Nanostructures (Carbon Nanotubes, Nanowires or Graphene). AIXTRON also manufactures full production and research scale deposition systems for silicon semiconductor applications capable of depositing material films on wafers of up to 300 millimeters diameter, employing technologies, such as Chemical Vapor Deposition (CVD), Atomic Vapor Deposition (AVD) and Atomic Layer! Deposition (ALD).
AIXTRON also offers a range of peripheral equipment and services, including products capable of monitoring the concentration of gases in the air and for cleaning the exhaust gas from metal organic chemical vapor deposition processes. The Company also assists its customers in designing the production layouts for the gas supply to thin film deposition systems. Additionally, the Company offers its customers training, consulting and support services.
The Company competes with Veeco Instruments Inc. (USA), Taiyo Nippon Sanso (Japan), Ulvac, Inc. (Japan), Tokki Corporation (Japan), Sumitomo (Japan), Applied Materials, Inc. (USA), Doosan DND Co., Ltd. (South Korea), Sunic System (South Korea), Tokyo Electron Ltd. (Japan), ASM International N.V. (Netherlands), IPS Technology (South Korea), Jusung Engineering Co. Ltd. (South Korea), and Hitachi Kokusai Electric Co. Inc. (Japan).
Advisors' Opinion:- [By Jon C. Ogg]
Aixtron SE (NASDAQ: AIXG) was downgraded to Sell from Hold at Canaccord Genuity.
Buffalo Wild Wings Inc. (NASDAQ: BWLD) was downgraded to Outperform from Strong Buy at Raymond James.
10 Best Semiconductor Stocks To Invest In Right Now: Advanced Semiconductor Engineering Inc (ASX)
Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.
The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.
Packaging Services
The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).
The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.
The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.
Testing Services
The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.
The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.
Advisors' Opinion:- [By Jeff Reeves]
Next Page
Best Stocks to Buy for Around $5: Advanced Semiconductor Engineering (ASX)Advanced Semiconductor Engineering�(ASX) builds and distributes integrated circuits and other electronics. While that�� not as sexy as other chipmakers that play to mobile, it�� still a good business, considering the general demand for microchips in everything from cars to computers to TVs.
- [By Alexis Xydias]
The FTSE 100 Index (UKX) gained 53.93 points, or 0.8 percent, to 6,683.93 at 8:58 a.m. in London, rebounding from a 1.4 percent loss yesterday. The benchmark has rallied 13 percent this year as central banks around the world commit to maintain monetary stimulus to nurture economic growth. The broader FTSE All-Share Index (ASX) increased 0.8 percent today, while Ireland�� ISEQ Index advanced 0.5 percent.
10 Best Semiconductor Stocks To Invest In Right Now: Applied Materials Inc.(AMAT)
Applied Materials, Inc. provides manufacturing equipment, services, and software to the semiconductor, flat panel display, solar photovoltaic (PV), and related industries worldwide. The company?s Silicon Systems Group segment offers a range of manufacturing equipment used to fabricate semiconductor chips or integrated circuits. This segment provides systems that perform primary processes used in chip fabrication, including atomic layer deposition, chemical vapor deposition, physical vapor deposition, electrochemical deposition, rapid thermal processing, chemical mechanical planarization, wet cleaning, and wafer metrology and inspection, as well as systems that etch or inspect circuit patterns on masks used in the photolithography process. Its Applied Global Services segment offers products and services designed to enhance the performance and productivity, and reduce the environmental impact of the fab operations of semiconductor, liquid crystal displays (LCDs), and solar P V manufacturers. The company?s Display segment provides products for manufacturing thin film transistor LCDs for televisions, personal computers (PCs), tablet PCs, smartphones, and other consumer-oriented electronic applications. Its Energy and Environmental Solutions segment offers manufacturing systems for the generation and conservation of energy, as well as manufacturing solutions for wafer-based crystalline silicon applications. This segment also provides roll-to-roll vacuum Web coating systems for deposition of a range of films on flexible substrates for functional, aesthetic, or optical properties; and roll-to-roll machine for depositing ultra-thin aluminum films for flexible packaging applications. The company serves manufacturers of semiconductor wafers and chips, flat panel LCDs, solar PV cells and modules, and other electronic devices. Applied Materials, Inc. was founded in 1967 and is headquartered in Santa Clara, California.
Advisors' Opinion:- [By Jayson Derrick]
Analysts at Bank of America upgraded Applied Materials (NASDAQ: AMAT) to Buy from Neutral with a $25 price target. Shares gained 0.47 percent, closing at $19.42.
- [By Stoyan Bojinov]
The Santa Clara-based semiconductor machinery manufacturer, Applied Materials (AMAT), announced quarterly operating results after the closing bell on Thursday, which barely topped analyst estimates.�
AMAT Earnings in Brief
-AMAT announced Q4 EPS of $0.19, managing to beat the projected figure of $0.18 per share by a penny.
-The company raked in revenues of $2.09 billion, coming in above the expected figure of $1.99 billion; this figure was 5% higher than the previous quarter and was largely bolstered by growth in silicon systems orders.
-Net sales in Q4 came in at $1.99 billion, up 1% sequentially.Updated Guidance
Applied Materials updated its guidance for Q1 2014 . The company now expects EPS to come in at $0.20-$0.24, compared to the Wall Street consensus of $0.23.
CEO Commentary
Gary Dickerson, AMAT’s president and CEO, had the following to say about the most recent quarter:�”This has been a transformative year for Applied Materials as we shaped a more competitive company, reduced overhead expenses, stepped up investment in product development and built momentum for profitable growth.” He went onto add, “As we look ahead to 2014, we expect stronger investment by our semiconductor and display customers and major technology inflections in transistor and memory that play to our strengths.”
Dividend Policy Updates
The company made no changes to its dividend policy. Applied Materials has a tendency to increase its payout in the first quarter of the year, and investors should watch out for this in 2014; most recently in Q1 2013, it raised its quarterly distribution from $0.09 to $0.10 a share.
Stock Performance
Investors weren’t too surprsied by AMAT’s results as the stock shed less than 1% in after hours trading on Thursday. Year-to-date, this stock has gained a stellar 53%.
10 Best Semiconductor Stocks To Invest In Right Now: On Track Innovations Ltd (OTIV)
On Track Innovations Ltd. (OTI) designs, develops and markets solutions based on its secure contactless microprocessor-based smart card technology to address the needs of a range of markets. The Company�� products combine the benefits of both microprocessors and contactless cards. In addition to contactless microprocessor-based smart cards, it also sells products that are based on other card technologies. The Company has focused on the development of its technologies and its products based on its technological platform that consists of smart cards, smart card readers, software tools and secure communication technology. As of December 31, 2012, it offers three lines of solutions, each of which constitutes a complete system, as well as components (such as smart cards and readers) that we sell to original equipment manufacturers (OEMs), for incorporation into their own products. OTI�� three vertical markets include Payment Solutions, Petroleum Systems and SmartID Solutions. Advisors' Opinion:- [By Markman Advisors]
Public companies leveraging their patent portfolios, (aka "patent plays"), are getting the market's attention. Companies such as Vringo (VRNG), ParkerVision (PRKR), MGT Capital (MGT), Worlds Inc. (WDDD.OB) and others have presented trading opportunities due to their volatility while retaining the chance for a big payoff to those investors who stay the course. Yet there exist viable patent plays that are still undiscovered. Some of these so called "plays," which are not getting enough attention, are actually real companies making and selling real products or services in contrast to pure patent monetization companies. Some known examples are Single Touch Interactive (SITO.OB) and Blue Calypso (BCYP.OB). This article is focused on another one of these patent plays, On Track Innovations Ltd. (OTIV).
- [By Roberto Pedone]
One under-$10 technology player that's starting to trend within range of triggering a major breakout trade is On Track Innovations (OTIV), which designs, develops and markets contactless microprocessor-based smart card solutions to customers in Africa, Europe, the Far East, the Americas and Israel. This stock has been red hot over the last three months, with shares up a whopping 134%.
If you take a look at the chart for On Track Innovations, you'll notice that this stock has been trending sideways and consolidating over the last month and change, with shares moving between $2.70 on the downside and $3.74 on the upside. Shares of OTIV have now started to spike higher off some near-term support at $3 a share and it's quickly moving within range of triggering a major breakout trade above the upper-end of its recent sideways trading chart pattern.
Traders should now look for long-biased trades in OTIV if it manages to break out above its 52-week high at $3.74 a share with high volume. Look for a sustained move or close above that level with volume that hits near or above its three-month average volume of 626,538 shares. If that breakout triggers soon, then OTIV will set up to enter new 52-week-high territory, which is bullish technical price action. Some possible upside targets off that breakout are $4.50 to $5.50 a share.
Traders can look to buy OTIV off weakness to anticipate that breakout and simply use a stop that sits just below some key near-term support levels at $3.20 or at $3 a share. One can also buy OTIV off strength once it starts to clear its 52-week high at $3.74 a share with volume and then simply use a stop that sits a comfortable percentage from your entry point.
10 Best Semiconductor Stocks To Invest In Right Now: Fairchild Semiconductor International Inc (FCS)
Fairchild Semiconductor International, Inc. (Fairchild) focuses on developing, manufacturing and selling power analog, power discrete and certain non-power semiconductor solutions to a range of end market customers. The Company is a supplier of power analog products, power discrete products and energy-efficient solutions, according to iSuppli. Its products are used in a range of electronic applications, including sophisticated computers and Internet hardware; communications, including wireless phones; networking and storage equipment; industrial power supply and instrumentation equipment; consumer electronics, such as digital cameras, displays, audio/video devices and household appliances, and automotive applications.
The Company�� product groups are organized by the end markets, which include Mobile, Computing, Consumer and Communication (MCCC), Power Conversion, Industrial and Automotive (PCIA) and Standard Discrete and Standard Linear (SDT). It invested in the wafer fabrication power semiconductor technology, including low and mid voltage PowerTrench, advanced insulated gate bipolar transistor (IGBT), as well as advanced high power metal oxide semiconductor field effect transistors (MOSFET) fabrication technologies.
Mobile, Computing, Consumer and Communication (MCCC)
The Company designs, manufactures and markets high-performance analog and mixed signal integrated circuits, low voltage power MOSFETs for mobile, consumer, computing, and communication applications. It has a portfolio of PowerTrench technology products. Its analog and mixed signal products are focused on the mobile end- markets.
Analog products monitor, interpret, and control continuously variable functions, such as light, color, sound, and energy. It forms the interface with the digital world. It provides a range of analog products that perform such tasks as voltage regulation, audio amplification, power and signal switching and system management. Analog voltage regulation circ! uits are used to provide constant voltages, as well as step up or step down voltage levels on a circuit board. These products enable improvements in power efficiency, lighting management, and improve charge times in ultraportable products. These products are used in a variety of mobile, computing, communications and consumer applications.
In addition to the power analog and interface products, it also offers signal path products. These include analog and digital switches, universal serial bus (USB) switches, video filters and high performance audio amplifiers. The analog switch functions are typically found in cellular handsets and other ultra portable applications. The video products provide a single chip solution to video filtering and amplification. Video filtering applications include set top boxes and digital television. Its solutions include surface mount devices, tiny packages, chip scale packages, and leadless carriers.
The Company also design, manufacture and market power semiconductor solutions for computing, communications, mobile, consumer and industrial applications. Power semiconductor solutions include, power discrete MOSFETs, analog integrated circuits, and fully integrated multi-chip and monolithic power solutions. Its power MOSFETs are primarily used in power delivery and power control applications. Power delivery and control applications are ubiquitous across data consumption, processing and communication applications. It produces advanced low power MOSFETs under its PowerTrench brands. The advanced power MOSFETs applications are used in smartphones, tablets, notebook personal computer, high performance gaming, home entertainment systems, servers, data communication, and routers.
The Company competes with Analog Devices, Inc., Linear Technology Corporation, Maxim Integrated Product, Inc., Micrel Inc, ON Semiconductor Corporation, ST Microelectronics N.V., Intersil Corporation, International Rectifier Corporation, Infineon Technologies AG and T! exas Inst! ruments Incorporated.
Power Conversion, Industrial and Automotive (PCIA)
Fairchild design, manufacture and market power discrete semiconductors, analog and mixed signal integrated circuits (ICs) for broad power conversion/power management, industrial, and automotive applications. Its products are building blocks that help convert a semi-regulated energy source (alternating current (AC)or direct current (DC)) to a regulated output for electronic systems (AC-DC, DC-AC, and DC-DC conversion). Its discrete devices are individual diodes or transistors that perform power switching, power conditioning and signal amplification functions in electronic circuits. The Company�� analog and mixed signal integrated circuits (IC) are used to control discrete semiconductors in applications, such as power switching, conditioning, signal amplification, power distribution and power consumption. It manufacture discrete products using vertical DMOS MOSFETs, Insulated Gate Bipolar Transistors (IGBT), Bipolar, and ultrafast rectifier technologies. It manufacture analog and mixed signal ICs using a range of bipolar (Bi), complementary metal oxide (CMOS), BiCMOS, and bipolar/CMOS/DMOS (BCDMOS) processes up to 1,200 volts and down to 0.35um (microns) minimum geometry.
Power MOSFETs are used in applications to switch, shape or transfer energy. These products are used in a range of high-growth applications, including solar inverters, uninterruptible power supplies (UPS), data centers and communications, motors, lighting, automotive, computing, displays and industrial supplies. It produce advanced power MOSFETs under its SupreMOS, SuperFET, PowerTrench, UniFET and QFET brands. IGBTs are high-voltage power discrete devices. They are used in switching applications for solar inverters, uninterruped power supply, data centers and communications, motors, industrial, power supplies, displays, television and automotive ignition systems. These applications require lower switching frequencies, highe! r power, ! and/or higher voltages than a power MOSFET can provide. It is a supplier of IGBTs. Rectifier products work with IGBTs and MOSFETs in many applications to provide power conversion and conditioning. Its product is the STEALTH rectifier, providing industry performance and efficiencies in data communications, industrial power supply, displays, television, and motor applications.
Leveraging its power MOSFET and IGBT technologies, it also design and manufacture modules for the industrial, automotive, and home appliance end markets. It design and develop a line of smart power modules (SPM) products targeted to various end applications in consumer white goods and industrial applications, which include room air conditioners, industrial power supplies, solar inverters, pumps, and industrial motors. These are multi-chip modules containing up to 28 components in a single package that includes diodes, power discrete IGBTs or MOSFETs, high voltage power management driver ICs and current and temperature sensors. Similar modules, called APM, are used in automotive applications.
The Company design and manufacture power management semiconductors for line-powered and off-line powered systems that integrate its Power MOSFETs. It sell and market off-line and isolated DC-DC ICs, MOSFET and IGBT gate driver ICs, and power factor correction ICs to the consumer, computing, display, television, lighting and industrial segments.
The Company competes with Infineon Technologies AG, ST MicroelectronicsN.V., International Rectifier Corporation, Toshiba Corporation, Mitsubishi Corporation, Texas Instruments Incorporated, Power Integrations, Inc., ON Semiconductor Corporation, NXP Semiconductors N.V. and Vishay Intertechnology, Inc.
Standard Linear and Standard Discrete (SDT)
Standard Diodes and Transistors products cover a range of semiconductor products, including MOSFET, junction field effect transistors (JFETs), high power bipolar, discrete small signal transistors, TVS,! Zeners, ! rectifiers, bridge rectifiers, Schottky devices and diodes. The Company design, manufacture and market analog integrated circuits for computing, consumer, communications, ultra-portable and industrial applications. These products are manufactured using bipolar, CMOS and BiCMOS technologies. Standard Linear solutions range from bipolar regulators, shunt regulators, low drop out regulators, standard op-amp/comparators, low voltage op-amps, and others. Analog voltage regulator circuits are used to provide constant voltages, as well as to step up or step down voltage levels on a circuit board. Op-amps/comparators are designed specifically to operate from a single power supply over a range of voltages. It also offer low-voltage op-amps that provide a combination of low power, rail-to-rail performance, low voltage operation, and tiny package options which are well suited for use in personal electronics equipment. Its solutions include surface mount devices, tiny packages and leadless carriers.
The Company competes with International Rectifier Corporation, Diodes Incorporated, NXP Semiconductors N.V., ST Microelectronics N.V., ON Semiconductor Corporation, Texas Instruments Incorporated, Vishay Intertechnology, Inc., Vishay Intertechnology, Inc, Osram Opto Semiconductors, OPTEK Technology, OMRON Corporation, Avago Technologies Ltd. and Kodenshi Corp.
Advisors' Opinion:- [By Brian Pacampara]
What: Shares of power chip specialist Fairchild Semiconductor (NYSE: FCS ) sank 10% today after its quarterly results and outlook missed Wall Street expectations.
- [By Alex Planes]
In an epochal paper published in Electronics magazine on April 19, 1965 and simply titled "Cramming more components onto integrated circuits," Fairchild Semiconductor (NYSE: FCS ) director of research Gordon E. Moore wrote (emphasis mine):
10 Best Semiconductor Stocks To Invest In Right Now: Malaysian Pacific Industries Bhd (MPI)
Malaysian Pacific Industries Berhad (MPI) is an investment holding company. The principal activities of MPI, through its subsidiaries are manufacturing, assembling, testing and sale of integrated circuits, semiconductor devices, electronic components and lead frames to customers globally. The Company�� operating geographical segments include Asia, The United States of America, and Europe. The Company's subsidiaries include Carsem (M) Sdn Bhd, Recams Sdn Bhd, Carsem Holdings Limited, Carsem Semiconductor (Suzhou) Co., Ltd, Dynacraft Industries Sdn Bhd, Carter Realty Sdn Bhd, Carter Realty Sdn Bhd and Carsem Holdings (HK) Limited. Advisors' Opinion:- [By Sofia Horta e Costa]
Michael Page International Plc (MPI) increased 1.1 percent to 490.2 pence after Goldman Sachs Group Inc. upgraded the stock to buy from neutral, saying the recruitment firm will benefit from a pick-up in the European economy.
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